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    SGTL-02 High-speed IC card back glue machine

    Technical parameters                    Dimensions:L1930mm*W660mm*H1760mmWeight:430KGPower:AC220V,50

    1. Detailed information

    Technical parameters                    

    Dimensions:L1930mm*W660mm*H1760mm

    Weight:430KG

    Power:AC220V,50Hz

    Rated power:0.8KW

    Air pressure:6KG/cm^2

    Gas consumption:80L/Min

    Control form:PLC+ Program control

    Production:12000pcs/h

     Performance characteristics

    1Automatic timing chips and chips that collect back glue

    2The chips and hot melt adhesive used for timely reporting and suspension

    3Special hot-melt adhesive for avoiding hollow hole die and chip stepping in the positioning of the positioning, make the move and the back glue faster and more accurate

    4High-precision thermostatic and heating up children make back glue more stable

    5The size of the mould can be used independently with large chip or small chip back glue