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    SICMP-03 Milling and sealing machine

    Technical parameters                    Dimensions:L3620mm*W960mm*H1750mmWeight:850KGPower:AC380V,50

    1. Detailed information

    Technical parameters                    

    Dimensions:L3620mm*W960mm*H1750mm

    Weight:850KG

    Power:AC380V,50/60Hz

    Rated power:8KW

    Air pressure:6KG/cm^2

    Gas consumption:180L/Min

    Control form:PLC+ Servo system

    Production:3200pcs/h

     Performance characteristics

    1:Double head milling groove, single head package, economical efficiency

    2:Groove type and groove size can be adjusted on the man-machine interface

    3:Accuracy not more than 0.01mm

    4:Use two cleaning methods

    5:The laser electronic eye confirms the slot situation and then the chip is encapsulated to reduce the chip loss

    5:The intelligent mode with card milling tank and no card milling groove is adopted

    6::Hold the card out of the box

    7:The size mold can be freely switched on the man-machine interface without manual replacement

    8:The hot welding head can be freely changed in man-machine interface without manual replacement