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  1. SSP-02 Solder back glue machine
  2. SSP-02 Solder back glue machine
  3. SSP-02 Solder back glue machine
  4. SSP-02 Solder back glue machine

SSP-02 Solder back glue machine

Technical parameters   Dimensions,:L2030mm*W885mm*H1750mm weight, :460KG         power, :AC380V,50HZ   rated power, :3.7KW  air pressure, :6KG/CM

  1. Detailed information

Technical parameters   

Dimensions,:L2030mm*W885mm*H1750mm 

weight, :460KG         

power, :AC380V,50HZ   

rated power, :3.7KW  

air pressure, :6KG/CM^2    

gas consumption: 90L/Min   

control form,:PLC+ Servo system

production speed:3200pcs/hour

Performance characteristics

1、 Automatic chip.

2、Automatic solder, automatic control of tin.

3、Automatic hot melt adhesive and hot melt adhesive to avoid empty holes.

4、Automatic back hot melt adhesive .

5、Hot melt glue used up and chip used automatic alarm and pause.

6、Automatic collection of good tin - back glue chip.

7、Magnify 50 times monitor to ensure solder and back glue are good.

8、Equipped with non-contact function test to ensure the quality of mill tin.

9、The servo system delivers tin ,Accurate and stable.

10、 Servo system solder. Accurate and stable.